プリント基板の基礎入門
ASIC [Application Specification Integrated Circuit]
BGA [Ball Grid Array]
CCD [Charge Coupled Device]
CMOS [Complementary Metal Oxide Semiconductor]
COB [Chip On Board].
CR [Capacitor & Resistor]
CSP [Chip Size (または Scale) Package]
DIP [Dual inline Package]
DRAM [Dynamic Random Access Memory]
EEPROM [Electrically Erasable Programmable Read Only Memory]
EPROM [Erasable Programmable Read Only Memory]
FPGA [Field Programmable Gate Array]
LGA [Land Grid Array]
Mask ROM
PLD [Programmable Logic Device]
PROM[Programmable Read Only Memory]
QFP [Quad Flat Package]
RAM[Random Access Memory]
ROM [Read Only Memory]
SMD [Surface Mount Device]
SOP [Small Out-line Package]
SRAM [Static Random Access Memory]
TAB [Tape Automated Bonding]
ピンラミネーション
フラッシュメモリ
メタルマスク